logo
Enviar mensagem

Detalhes dos produtos

Created with Pixso. Casa Created with Pixso. Produtos Created with Pixso.
Fita de Packaing do semicondutor
Created with Pixso.

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

KHJ TS651ZF Heat Release Tape Acrylic Adhesive Ultra-Thin Wafer Dicing Delicate Factory Manufacturer

Nome da marca: KHJ
Número do modelo: TS651ZF
Informações detalhadas
Lugar de origem:
China
Certificação:
RoHS
Descrição do produto
PRODUCT DESCRIPTION TS651ZF is a white heat-release adhesive tape with high initial tack. It retains adhesion at elevated temperatures until the adhesive foams and loses tack at 190℃, achieving automatic separation from the substrate. Product Structure Product Features * Initial heat resistance; non-re-tacky * High instantaneous adhesion with precise positioning; components are easily removed after heat debonding, leaving no adhesive residue Product Applications Suitable for