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Mlcc Cutting tape Ceramics Capacitance Wafer Cutting -TS610G

Mlcc Cutting tape Ceramics Capacitance Wafer Cutting -TS610G

Nome da marca: KHJ
Número do modelo: TS610G
Informações detalhadas
Lugar de origem:
China
Descrição do produto

Description


TS610G is a green translucent thermal separation tape with high initial

viscosity. At a certain temperature (125~140℃), the stickiness of the adhesive surface disappears and automatic separation from the object to be adhered can be achieved.

 

Construction


Mlcc Cutting tape Ceramics Capacitance Wafer Cutting -TS610G 0

 

Features

 Easily peeled off by heat treatment at any time
 Initial temperature resistance and will not re-tack
 RoHS Compliant
 
Application

This product is suitable for temporarily fixing various types of components,
ceramics, glass, metal plates, etc., and is suitable for various electronic
industry specialties. kind of cutting protection
 

Properties


Item Typical Value Test Method
Imperial Metric
Backing 4.0mil 0.1mm /
Total Thickness 6.2mil 0.155mm /
Tack / ≥12(J.DOW/#) /
Adhesion Before heating 3.3lbs/in 15N/25mm GBT 2792-2014
After heating 0 0
Tensile Strength ≥20lbs/in ≥3.5(KN/M) GBT 30776-2014
Elongation ≥45% ≥45% GBT 30776-2014

 

Recommended debonding process: 130℃*3-15min(based on the heating method and the thermal conductivity and heat transfer uniformity of the attached object)

 

Storage


Store under normal conditions of 10-30℃ and 40-70% R.H, out of direct sunlight.

Shelf life: 12 months from the date of manufacture when stored in initial packing.

 

Precaution Reminder


Surface should be clean, dry, free of dust, oil or other contaminants.

Proper pressure required by roller, hand or press when applying.

Avoid repeat sticking to prevent adhesion decrease.

 

Notes


Please be advised that this technical data sheet is written based on our lab tests and experience only. Customer is responsible to determine the suitability of the product meets intended application requirements before approved for use