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DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

DTS641A Double-Sided Heat Release Tape for MLCC Semiconductor Wafer Dicing Backgrinding | High-Adhesion No-Residue Thermal Debonding PET 90-150C | PCB Ceramic Glass LED Cutting Temp Fix Assembly | KHJ

Nome da marca: KHJ
Número do modelo: DTS641A
Informações detalhadas
Lugar de origem:
China
Certificação:
ROHS、ISO9001
Descrição do produto
Product Description DTS641A is a double-sided tape with good initial tack. Both sides are covered with foam rubber layers. Under the condition of 110-140 ℃, the viscosity of the foam rubber surface gradually disappears, and it can automatically separate from the adhered objec. Product structure Product features Excellent weather resistance, no re-adhesion Strong instantaneous viscosity, components are easy to remove after thermal viscosity reduction without residual adhesive